Vencreat today announced that both hardware lines built on the Rockchip RV1126B — the CM38-RV1126B core board and the RV1126B IPC 50×50mm camera core — have completed volume validation and moved into regular supply. The core board targets design houses and OEMs that want to build their own carrier; the camera core targets camera makers who would rather ship a finished device. Both share one BSP and one SDK.
One SoC, two delivery formats
The RV1126B is Rockchip’s AI vision processor: quad-core Cortex-A53 with a 3 TOPS NPU that runs models up to 2B parameters on-device, a 12M@30fps ISP plus 8M@30fps AI-ISP, up to 5 simultaneous camera inputs, and encoding up to 4K@45fps.
The CM38-RV1126B packs that into a 38mm BTB module with J1/J2 dual connectors totalling 200 pins, complete pin definitions and a reference design — so customers can build a carrier that matches their own mechanical design.
The IPC camera core takes the other route: a 50×50mm mainboard plus sensor board, 4G board and PoE board, with mounting holes matching the previous-generation IPC38 board so existing housings can be reused. This revision specifically addresses the thermal and production-stability issues that held the IPC38 board back.
Why both formats
The two products look redundant until you look at the customer. A team with mechanical engineers who wants a differentiated appearance needs a core board and its own carrier. A team that wants to ship quickly — or that does not want to cut new tooling — needs a camera core with boards included.
Same silicon, same SDK. Moving from the camera core to the core board does not require rewriting algorithms or application software.
Scenarios already in production
Multi-sensor smart IPC and PTZ linkage, industrial machine vision inspection, solar and battery cameras, and dual-lens doorbells are where these platforms land most often. The common thread: on-device AI analytics together with low power and low-light imaging — hard to satisfy with cloud compute alone, or with a low-end SoC alone.
Delivery and documentation
Both products support small-batch sampling. Datasheets are available in English and Chinese, together with the hardware design guide, reference design and IPC SDK. Carrier board customization and complete-device ODM are available, with certification support.
Product pages:
- CM38-RV1126B Core Board: https://vencreat.com/product/cm38-rv1126b-core-board-en/
- RV1126B IPC Camera Core: https://vencreat.com/product/ai-ipc-camera-core-en/
Contact: www.vencreat.com | sales@vencreat.com