RV1126B IP Camera
An RV1126B IP camera mainboard for smart cameras, video capture and edge vision products, built to accelerate camera integration.
描述

Accelerate smart-camera hardware and system integration
The RV1126B IP Camera board is designed for network cameras, video capture and edge vision devices, with practical connectivity for camera, network, storage and wireless expansion.
Buyer value
- Suitable for IP cameras, smart monitoring, machine vision and video-analysis terminals
- Supports camera, display, network, storage and common control-interface expansion
- System image, driver adaptation, sensor tuning and complete-device development support available
Project inquiry
Sensor compatibility, interface revision, wireless configuration and temperature requirements are confirmed per project. Share the sensor model, resolution, interface and volume plan.


Chip Selection and Industry Applications
Choose a platform by evaluating CPU, NPU, vision pipeline, interfaces, power, OS support and production schedule together. TOPS alone does not determine system-level results.
| Platform | CPU | NPU | Multimedia / Vision | Best-fit Direction |
|---|---|---|---|---|
| RK3506 | 3× Cortex-A7 | — | Control / audio / lightweight HMI | HMI, PLC, voice modules, serial terminals |
| RK3562 | 4× Cortex-A53 | 1 TOPS | 4K30 decode; 13 MP ISP | Low-power AIoT, HMI, POS, data acquisition |
| RK3566 | 4× Cortex-A55 | up to 1 TOPS | 4K60 decode; 8 MP ISP | SBC, smart display, IoT gateway, lightweight edge AI |
| RK3576 | 4× Cortex-A72 + 4× Cortex-A53 | 6 TOPS | 8K30 decode; 16 MP ISP | Industrial gateway, machine vision, robotics, multi-display HMI |
| RV1126B | 4× Cortex-A53 | 3 TOPS | 4K45 encode; 12 MP ISP / 8 MP AI-ISP | AI IPC, access control, industrial vision, multi-camera terminals |
Related Applications
- AI IP cameras and video analytics
- Smart access and identity recognition
- Industrial vision inspection
- Robotics vision, smart vehicles and multi-camera terminals
Compiled from official Rockchip product pages and brief datasheets. Confirm interfaces, industrial temperature, memory and OS support against the selected carrier board and BSP release.




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