RK3562 SOM
An RK3562 system-on-module for industrial control, smart displays and compact edge devices, designed to simplify carrier-board development.
描述
Modular SOM for industrial control and smart terminals
The RK3562 SOM supports embedded products that need stable computing, display connectivity and peripheral expansion. The modular design enables rapid prototyping and customized carrier boards.
Buyer value
- Suitable for HMI, smart panels, industrial gateways, retail terminals and control equipment
- Consolidates core components on the SOM to reduce carrier-board complexity
- Hardware customization, software adaptation, testing and production support available
Project inquiry
Memory, storage and interface combinations are confirmed per project. Send your requirement list for a technical review.
Chip Selection and Industry Applications
Choose a platform by evaluating CPU, NPU, vision pipeline, interfaces, power, OS support and production schedule together. TOPS alone does not determine system-level results.
| Platform | CPU | NPU | Multimedia / Vision | Best-fit Direction |
|---|---|---|---|---|
| RK3506 | 3× Cortex-A7 | — | Control / audio / lightweight HMI | HMI, PLC, voice modules, serial terminals |
| RK3562 | 4× Cortex-A53 | 1 TOPS | 4K30 decode; 13 MP ISP | Low-power AIoT, HMI, POS, data acquisition |
| RK3566 | 4× Cortex-A55 | up to 1 TOPS | 4K60 decode; 8 MP ISP | SBC, smart display, IoT gateway, lightweight edge AI |
| RK3576 | 4× Cortex-A72 + 4× Cortex-A53 | 6 TOPS | 8K30 decode; 16 MP ISP | Industrial gateway, machine vision, robotics, multi-display HMI |
| RV1126B | 4× Cortex-A53 | 3 TOPS | 4K45 encode; 12 MP ISP / 8 MP AI-ISP | AI IPC, access control, industrial vision, multi-camera terminals |
Related Applications
- Industrial HMI and power control
- Smart POS, access control and signage
- Smart-home panels and appliances
- Data acquisition and low-power AIoT
Compiled from official Rockchip product pages and brief datasheets. Confirm interfaces, industrial temperature, memory and OS support against the selected carrier board and BSP release.
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