RK3576 SOM

A scalable RK3576 system-on-module for edge AI, industrial vision and multimedia terminal development.

描述

RK3576 SOM

Modular computing platform for edge AI and industrial vision

The RK3576 SOM integrates key processing, memory and storage functions in a compact module, helping device makers reduce mainboard design and system-integration time.

Buyer value

  • Suitable for edge inference, industrial vision, smart terminals and multimedia equipment
  • Module-and-carrier design supports interface tailoring, upgrades and product-family development
  • Sample validation, carrier-board design, OS adaptation and production-introduction support available

Project inquiry

Memory, storage, interface and temperature configurations are confirmed against the project specification. Send your interface list, volume estimate and target schedule.

RK3576 SOM edge AI specificationsRK3576 SOM high-speed interfaces and industrial applications

Chip Selection and Industry Applications

Choose a platform by evaluating CPU, NPU, vision pipeline, interfaces, power, OS support and production schedule together. TOPS alone does not determine system-level results.

Platform CPU NPU Multimedia / Vision Best-fit Direction
RK3506 3× Cortex-A7 — Control / audio / lightweight HMI HMI, PLC, voice modules, serial terminals
RK3562 4× Cortex-A53 1 TOPS 4K30 decode; 13 MP ISP Low-power AIoT, HMI, POS, data acquisition
RK3566 4× Cortex-A55 up to 1 TOPS 4K60 decode; 8 MP ISP SBC, smart display, IoT gateway, lightweight edge AI
RK3576 4× Cortex-A72 + 4× Cortex-A53 6 TOPS 8K30 decode; 16 MP ISP Industrial gateway, machine vision, robotics, multi-display HMI
RV1126B 4× Cortex-A53 3 TOPS 4K45 encode; 12 MP ISP / 8 MP AI-ISP AI IPC, access control, industrial vision, multi-camera terminals

Related Applications

  • Machine vision and industrial inspection
  • Industrial gateways and edge AI
  • Robotics, AGV and sensor fusion
  • Multi-display HMI, energy and medical control

Compiled from official Rockchip product pages and brief datasheets. Confirm interfaces, industrial temperature, memory and OS support against the selected carrier board and BSP release.

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