CM38-RV1126B Core Board | 38mm BTB | 3 TOPS AI Vision, 12MP ISP
CM38-RV1126B 38 mm BTB core board with quad Cortex-A53, 3 TOPS NPU, 12 MP ISP and 5 camera inputs for multi-sensor AI cameras, machine vision and low-power vision terminals.
Description
CM38-RV1126B 38mm BTB Core Board
A 38 mm board-to-board core board built on the Rockchip RV1126B, with J1/J2 dual BTB connectors (200 pins total), 3 TOPS NPU and a 12 MP ISP. It is designed for multi-sensor AI cameras, machine vision and low-power AI vision terminals.
Key specifications
| Item | Specification |
|---|---|
| CPU | RV1126B, quad-core Cortex-A53 |
| NPU | 3 TOPS, supports on-device models up to 2B parameters |
| ISP | 12M@30fps, 8M@30fps AI-ISP |
| Video | 4K@45fps H.264 / H.265 encoding |
| Camera input | Up to 5 simultaneous sensors, multi-view stitching |
| Connectors | J1 / J2 dual BTB, 200 pins in total |
| Form factor | 38 mm BTB module |
| OS | Linux / IPC SDK |
What RV1126B brings to a vision product
RV1126B is Rockchip’s new-generation AI vision SoC, built for smart IPC, machine vision and multi-sensor camera products. Compared with the previous generation it upgrades ISP, NPU and encoding across the board:
- 12 MP ISP: full 12M@30fps pipeline with 8M@30fps AI-ISP for low-light colour imaging, dehazing and noise reduction — all algorithms on-chip.
- 3 TOPS NPU for on-device models: INT8 quantisation runs LLMs up to 2B parameters and mainstream vision models (face, person, vehicle, behaviour analysis), with INT16/FP16 for accuracy-critical cases.
- 5 simultaneous camera inputs: rare multi-sensor capability at this class — binocular stitching, four-camera panorama and pan-tilt/PTZ linkage on a single core board.
- 4K@45fps encoding: H.264/H.265 smart encoding keeps bitrate low at high image quality, cutting storage and bandwidth cost.
- Low-power always-on design: suits battery-powered products and outdoor or low-power form factors.
RV1126B vs RV1126 vs RV1106: which vision platform fits?
| Platform | CPU | NPU | ISP | Camera input | Encoding | Best fit |
|---|---|---|---|---|---|---|
| RV1126B | 4× A53 | 3 TOPS | 12M@30 | 5 sensors | 4K@45 | Multi-sensor smart IPC and machine vision flagship |
| RV1126 | 4× A7 | 2 TOPS | 5M | 1–2 sensors | 5M@30 | Previous-generation mainstream IPC |
| RV1106 | 1× A7 | 0.5 TOPS | 4M | 1 sensor | 3M@30 | Cost-driven, low-power camera modules |
| RK3562 | 4× A53 | 1 TOPS | 4M | 1–2 sensors | 4K@30 | General industrial vision |
Selection guide: choose RV1126B for multi-sensor stitching, 12 MP imaging or on-device LLMs; choose RV1106 for low-cost single-sensor camera modules; choose RK3562 for non-camera industrial inspection.
Compared with legacy Hisilicon IPC platforms, RV1126B wins on supply continuity, an open SDK and NPU support for on-device LLMs. Compared with low-cost SoCs, its AI-ISP low-light and multi-sensor capability are in a different class.
Applications
Multi-sensor smart IPC and PTZ linkage. Five camera inputs combine panorama and detail in one unit — fisheye stitching and multi-view panoramic cameras integrate directly.
Machine vision inspection. 12 MP resolution plus 3 TOPS supports industrial quality inspection, code readers and smart scales.
Battery cameras and low-power IPC. Always-on and low-power modes with AI-ISP night vision for outdoor battery and solar camera designs.
Video door locks and doorbells. Fast boot, low-bitrate encoding and human detection in a complete reference design.
Also available in this family: CM38 datasheet (CN/EN), the EVB1126B evaluation board, the RV1126B SOM, IPC module boards and complete-device ODM.
FAQ
What is the difference between RV1126B and RV1126?
RV1126B is a new-generation platform: CPU moves from A7 to A53, NPU from 2 to 3 TOPS with on-device LLM support, ISP from 5 MP to 12 MP, plus 5 camera inputs and 4K@45 encoding. Existing projects should migrate directly to RV1126B rather than staying on RV1126.
Which camera sensors are supported?
Mainstream Sony, OmniVision and SmartSens sensors up to 12 MP have driver coverage. Send us your target part numbers for a compatibility list.
Do you provide a complete IPC device solution?
Yes — three levels: evaluation board, IPC module board, and complete device including enclosure, 4G and cloud integration through ODM.
Next step
Share your camera configuration, interfaces, target cost and estimated volume, and we will come back with a configuration review and an OEM/ODM proposal. Samples and documentation: contact us or sales@vencreat.com.
